The Evolution of Intel s Copy EXACTLY ! Technology Transfer Method

Semiconductor manufacturing is characterized by very complex process flows made up of individual process steps, many of which are built to very close tolerances. Furthermore, there are complex interactions in these process flows, whereby each process step can affect many other steps, and each final device parameter might be determined by the results from many inputs. This level of complexity is increasing with each new technology generation. Items that were once considered second-order effects, such as barometric pressure and ultra pure water temperature, are now important variables affecting process results. The costs of technology development and capital equipment for production are very high and are increasing with each generation, thus making technology transfer very important. Once a new process flow and product portfolio have been developed, it is essential that the technology transfer to mass production take place as quickly as possible, without disrup-tive quality issues, and with the highest possible yield. No time is available to debug new problems that occur during the transfer. The traditional technology transfer approach often allows many equipment and process changes to be made. These changes are intended as improvements in the process, or they are for the convenience of the production factory, which may be already producing other products. As semiconductor technology becomes more complex, these changes have resulted in unforeseen problems that cause production start-up delays and inferior results. The Copy EXACTLY! philosophy and systems were developed [6] in order to minimize the time required for a technology to be transferred and to ensure product quality and yields are not compromised. The methodology has been improved and refined, and has become an important element in Intel’s overall manufacturing strategy [1]. This paper describes the Copy EXACTLY! methodology and the increase in technology transfer performance that it has brought about. Some side benefits of this methodology are also discussed.